? semiconductor components industries, llc, 2016 october, 2016 ? rev. 2 1 publication order number: nb7vpq701m/d nb7vpq701m 1.8 v usb 3.1 single channel re-driver description the nb7vpq701m is a 1.8 v single channel re?driver for usb 3.1 gen 1 and usb 3.1 gen 2 applications that supports both 5 gbps and 10 gbps data rates. signal integrity degrades from pcb traces, transmission cables, and inter?symbol interference (isi). the nb7vpq701m compensates for these losses by engaging varying levels of equalization at the input receiver and de?emphasis on output driver. the output transmitter circuitry provides user selectable de?emphasis and output amplitude settings to create the best eye openings for the outgoing data signals. the nb7vpq701m features an intelligent lfps circuit. this circuit senses the low frequency signals and automatically disables driver de?emphasis for full usb 3.1 gen 1 and usb 3.1 gen 2 compliances. after power up, the nb7vpq701m periodically checks both of the tx output pairs for a receiver connection. when the receiver is detected the rx termination becomes enabled and the nb7vpq701m is set to perform the re?driver function. the nb7vpq701m comes in a small, ultra?thin 1.6 x 1.6 mm uqfn12 package and is specified to operate across the entire industrial temperature range, ?40 c to 85 c. features ? 1.8 v 5% power supply ? device supports usb 3.1 gen 1 and usb 3.1 gen 2 data rates ? automatic lfps de?emphasis control ? automatic receiver termination detection ? integrated input and output termination ? selectable equalization, de?emphasis, and output swing ? chip enable pin for deep power?saving mode ? hot?plug capable ? esd protection 4 kv hbm ? operating temperature range: ?40 c to 85 c ? small 1.6 x 1.6 x 0.5 mm uqfn12 package ? this is a pb?free device typical applications ? mobile phone and tablet ? computer and laptop ? docking station and dongle ? active cable, back planes ? gaming console, smart t.v. device package shipping ? ordering information NB7VPQ701MMUTBG uqfn12 (pb?free) 3000 / tape & reel uqfn12 case 523av marking diagram www. onsemi.com 1 vp = specific device code m = date code = pb?free package vp m 1 (note: microdot may be in either location) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d.
nb7vpq701m www. onsemi.com 2 figure 1. logic diagram of nb7vpq 701m figure 2. uqfn12 p ackage pinout (top view) table 1. pin description pin number pin name type description 1 vcc power 1.8 v power supply 2 gnd power reference ground 3 rx+ differential input pair differential input pair for 5 / 10 gbps usb signals. must be externally ac?coupled. 4 rx - 5 nc1 n/a no connect ? float pin 6 os cmos input sets output amplitude on the tx. 3?state input with integrated 250 k pull?up and pull?down resistors. defaults to mid when left open. 7 eq cmos input sets equalizer gain on the rx. 3?state input with integrated 250 k pull?up and pull?down resistors. defaults to mid when left open. 8 de cmos input sets the output de?emphasis. 3?state input with integrated 250 k pull?up and pull?down resistors. defaults to mid when left open. 9 en cmos input chip enable input (active high), internal 550 k pull?up resistor. low to power down. 10 nc2 n/a no connect ? float pin 11 tx - differential output pair differential output for 5 / 10 gbps usb signals. must be externally ac?coupled . 12 tx+
nb7vpq701m www. onsemi.com 3 device configuration table 2. control pin effects (typical values) pin description logic state equalization gain eq equalization amount low 3 db mid 6 db high 9 db pin description logic state de?emphasis ratio (note 1) os = low os = float os = high de de?emphasis amount low 0 db ?4 db ?6 db mid ?3 db ?5.5 db ?7.5 db high ?5.5 db ?7 db ?9 db pin description logic state output swing os output swing with de pin low (0 db) low 750 mv pp mid 900 mv pp high 1000 mv pp pin description logic state chip enable en chip enable input low chip disabled (deep power?saving mode) high chip enable 1. db decrease = 20 log * (v tx?de / v tx?diff?pp ) table 3. attributes parameter esd protection human body model charged device model > 4 kv > 1.5 kv moisture sensitivity, indefinite time out of drypack (note 2) level 1 flammability rating oxygen index: 28 to 34 ul 94 v?o @ 0.125 in transistor count 704 meets or exceeds jedec spec eia/jesd78 ic latchup test 2. for additional information, see application note and8003/d. table 4. absolute maximum ratings over operating free?air temperature range (unless otherwise noted) parameter description min max unit supply voltage (note 3) v cc ?0.3 2.5 v voltage range at any input or output terminal differential i/o ?0.5 1.89 v lvcmos inputs ?0.3 v cc + 0.3 v electrostatic discharge human body model (all pins) (note 4) 4 kv charged device model (all pins) (note 4) 1.5 kv storage temperature, t sg ?65 150 c maximum junction temperature, t j ?40 125 c junction?to?ambient thermal resistance, ja 138 c/w stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 3. all voltage values are with respect to the gnd terminals. 4. tested in accordance with jedec standard.
nb7vpq701m www. onsemi.com 4 table 5. recommended operating conditions over operating free?air temperature range (unless otherwise noted) parameter description min nom max unit v cc main power supply 1.71 1.8 1.89 v t a operating free?air temperature ?40 +85 c c ac ac coupling capacitor 75 100 200 nf functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. table 6. power supply characteristics parameter test conditions min typ (note 5) max unit i cc active link in u0 with ss data transmission de = low 0 db , eq = low 3 db , os = low 65 ma idle state link has some activity, not in u0 de = mid ?3 db , eq = mid 6db os = low 49 ma u2/u3 link in u2 or u3 power saving state de = mid ?3 db , eq = mid 6 db , os = low 4.5 ma no usb connection no connection state, termination disabled de = mid ?3 db , eq = mid 6 db , os = low 4.5 ma deep power?saving state part disabled by en pin en = low 28 a 5. typ values use v cc = 1.8 v, t a = 25 c. table 7. lvcmos control pin characteristics parameter test conditions min typ max unit 3?state lvcmos inputs (eq, de, os) and 2?state lvcmos inputs (en) v ih high?level input voltage 0.8 * v cc v cc v v im mid?level input voltage 0.4 * v cc v cc / 2 0.6 * v cc v v il low?level input voltage gnd 0.2 * v cc v v f floating voltage v in = high impedance v cc / 2 v r pu internal pull?up resistance 250 k r pd internal pull?down resistance 250 k i ih high?level input current v in = 1.89 v 20 a i il low?level input current v in = gnd, v cc = 1.89 v ?20 a
nb7vpq701m www. onsemi.com 5 table 8. receiver ac/dc characteristics over operating free?air temperature range (unless otherwise noted) parameter test conditions min typ max unit vrx?diff?pp input differential voltage swing ac?coupled, peak?to?peak 250 1200 mv pp vrx?cm common?mode voltage bias in the receiver (dc) v cc ? 0.25 v zrx?diff differential input impedance (dc) present after an usb device is detected on tx+/tx? 80 100 120 zrx?cm common?mode input impedance (dc) present after an usb device is detected on tx+/tx? 20 25 30 zrx?high?imp common?mode input impedance with termination disabled (dc) present when no usb device is detected on tx+ 25 35 k vth?lfps?pp low frequency periodic signaling (lfps) detect threshold output voltage is considered squelched below this threshold voltage. 300 mv pp table 9. transmitter ac/dc characteristics over operating free?air temperature range (unless otherwise noted) parameter test conditions min typ max unit vtx?diff?pp output differential voltage swing at 5 gbps, 10 gbps with de low (0 db) os = low, 50 to v cc 750 mv pp os = mid, 50 to v cc 900 os = high, 50 to v cc 1000 ctx tx input capacitance to gnd at 2.5 ghz 1.25 pf ztx?diff differential output impedance (dc) present after an usb device is de- tected on tx+/tx? 80 100 120 ztx?cm common?mode output impedance (dc) present after an usb device is de- tected on tx+/tx? 20 30 itx?sc tx short circuit current tx+ or tx? shorted to gnd 30 ma vtx?cm common?mode voltage bias in the transmitter (dc) v cc ?0.5 v cc v vtx?cm?acpp ac common?mode peak?to?peak volt- age swing in active mode within u0 and within lfps 100 mv pp vtx?idle?diff? acpp differential voltage swing during electrical idle tested with a high?pass filter 0 10 mv pp vtx?rxdet voltage change to allow receiver detect positive voltage to sense receiver termination 600 mv t r , t f output rise, fall time 20% ? 80% of differential voltage measured 1 inch from the output pin 45 ps t rf?mm output rise, fall time mismatch 20% ? 80% of differential voltage measured 1 inch from the output pin 5 ps t diff?lh , t diff?hl differential propagation delay de?emphasis = ?3 db, os = low propagation delay between 50% level at input and output 150 ps t idleentry , t idleexit idle entry and exit times 30 ns
nb7vpq701m www. onsemi.com 6 table 10. timing and jitter characteristics parameter test conditions min typ max unit timing tready time from power applied until rx termi- nation is enabled apply 0 v to v cc , connect usb ter- mination to tx , apply 1.8 v to v cc , and measure when zrx?diff is enabled 10 ms jitter for 5 gbps tjtx?eye total jitter (notes 6, 7) eq = mid 6 db, de = high ?5.5 db , os = low 0.087 ui (note 8) djtx deterministic jitter (note 7) 0.023 ui (note 8) rjtx random jitter (note 7) 0.006 ui (note 8) jitter for 10 gbps tjtx?eye total jitter (notes 6, 7) eq = mid 6db, de = high ?5.5 db , os = low 0.207 ui (note 8) djtx deterministic jitter (note 7) 0.082 ui (note 8) rjtx random jitter (note 7) 0.013 ui (note 8) 6. includes rj at 10 ?12 . 7. measured at the ends of reference channel with a k28.5 pattern, vid = 1000 mvpp, ?3.5 db de?emphasis from source. 8. 5 gbps, ui = 200 ps for 10 gbps, ui = 100 ps
nb7vpq701m www. onsemi.com 7 oscilloscope tx rx 50 x? fr?4 pattern gen. dut soldered figure 3. equalization measurement setup figure 4. 5 gbps signal with 24 inches of fr4 before input to nb7vpq701m and after using high eq setting figure 5. 10 gbps signal with 12 inches of fr4 before input to nb7vpq701m and after with eq floating (mid)
nb7vpq701m www. onsemi.com 8 oscilloscope dut soldered tx rx x? fr?4 pattern gen. figure 6. de?emphasis measurement setup 50 figure 7. 5 gbps signal after 24 inches of fr4 at output with high de setting to nb7vpq701m figure 8. 10 gbps signal after 9 inches of fr4 at output with high de setting to nb7vpq701m
nb7vpq701m www. onsemi.com 9 parameter measurement diagrams figure 9. transmitter differential voltage db decrease = 20 log * (v tx?de / v tx?diff?pp ) figure 10. propagation delay figure 11. output rise and fall times rx? rx+ tx? tx+ v ol v oh application guidelines lfps compliance testing as part of usb 3.1 compliance test, the host or peripheral must transmit a lfps signal that adheres to the spec parameters. when using a real?time oscilloscope to capture this data, the scope?s trigger must be below 0 v when making single?ended measurements . although the differential signal is identical to that which is expected by the usb 3.1 system, the ac common mode voltage for lfps may fall below 0 v during short bursts of switching signal, which is still within the spec?s limit. lfps functionality usb 3.1 links use low frequency periodic signaling (lfps) to implement functions like exiting low?power modes, performing warm resets and providing link training between host and peripheral devices. lfps signaling consists of bursts of frequencies ranging between 10 to 50 mhz and can have specific burst lengths or repeat rates. ping.lfps for tx compliance during the transmitter compliance, the system under test must transmit certain compliance patterns as defined by the usb?if. in order to toggle through these patterns for various tests, the receiver must receive a ping. lfps signal from either the test suite or a separate pattern generator. the standard signal comprises of a single burst period of 100ns at 20 mhz. in order to pass this signal through nb7vpq701m, the duration of the burst must be extended to at least 200 ns.
nb7vpq701m www. onsemi.com 10 package dimensions case 523av issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. a b e d bottom view b e 12x 2x 0.05 c pin one reference top view 2x 0.05 c a a1 0.05 c 0.05 c c seating plane side view l2 1 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.152 ref b 0.15 0.25 d 1.60 bsc e 1.60 bsc e 0.40 bsc l 0.20 0.40 detail b *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* l l2 0.40 0.60 detail b exposed cu alternate construction 0.07 b 0.05 a c c m m e/2 12x a3 8x 4x 36 12 9 pitch 0.64 12x dimensions: millimeters 1 0.26 1.80 1.80 0.40 0.44 8x package outline 4x l1 detail a l alternate terminal constructions l detail a on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nb7vpq701m/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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